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DATA SHEET
SKY65131: WLAN Power Amplifier Module
Applications
* IEEE802.11 b/g WLAN * ISM band transmitters * WCS fixed wireless * Wireless access nodes
Description
The Skyworks SKY65131 is a Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SKY65131 ideal for Wireless Local Area Network (WLAN) applications. The device is fabricated using Skyworks high reliability Indium Gallium Phosphide (InGaP) Heterojunction Bipolar Transistor (HBT) technology. The device is internally matched and mounted in a 4 x 4 mm, Multi-Chip Module (MCM) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution. The device package and pinout are shown in Figure 1. A block diagram of the SKY65131 is shown in Figure 2.
Features
* Single 3.3 V supply * Linear output power of +28 dBm for IEEE802.11b mask * Linear output power of +26 dBm for IEEE802.11g mask * High PAE of 38 percent * Output power detector: 20 dB dynamic range * Superior gain flatness * Small MCM (16-pin, 4 x 4 mm), Pb-free SMT package (MSL3, 250 C per JEDEC J-STD-020) * PA shutdown control
VCC_DET
GND
1
16
GND
* Internal RF match and bias circuits
15
14
V_DET
13
VDET_CNTL
RF_IN
2
12
RF_OUT
Skyworks offers lead (Pb)-free "environmentally friendly" packaging that is RoHS compliant (European Parliament for the Restriction of Hazardous Substances).
RF_IN
3
11
RF_OUT
VCC1
4
10
GND
VC_BIAS
5
6
7
8
9
VCC2
VREF1
VREF2
PA_ON
S106
Figure 1. SKY65131 Pinout - 16-Pin MCM (Top View)
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DATA SHEET * SKY65131
VCC1 VC_BIAS
VREF1 PA_ON
VREF2
VCC2 VCC_DET
Active Bias
Detector
V_DET
RF_IN
Input Match Stage 1 PA
Inter-Stage Match Stage 2 PA
Output Match
RF_OUT
S107
Figure 2. SKY65131 Block Diagram
Technical Description
The SKY65131 PA contains all of the needed RF matching and DC biasing circuits. The device also provides an output power detector voltage and the ability to switch the PA on or off with a simple control signal. The SKY65131 is a two-stage, HBT InGaP device optimized for high linearity and power efficiency. These features make the device suitable for wideband digital applications, where PA linearity and power consumption are of critical importance (e.g., WLANs). The device has been characterized with the highest specified data rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency.
precaution should be taken to ensure that the part is not subjected to temperatures exceeding 250 C for more than 10 seconds. For details on both attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note, PCB Design and SMT Assembly/Rework Guidelines for MCM-L Packages, document number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the Skyworks Application Note, Tape and Reel, document number 101568.
Electrical and Mechanical Specifications
Signal pin assignments and functional pin descriptions are described in Table 1. The absolute maximum ratings of the SKY65131 are provided in Table 2. Electrical specifications are provided in Table 3. Typical performance characteristics are shown in Figures 3 through 9. A schematic diagram of the SKY65131 Evaluation Board is shown in Figure 10. Package dimensions for the SKY65131 16-pin MCM are shown in Figure 14, and tape and reel dimensions are shown in Figure 15.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY65131 is rated to Moisture Sensitivity Level 3 (MSL3) at 250 C. It can be used for lead or lead-free soldering. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 C per second. Maximum temperature should not exceed 250 C. If the part is manually attached,
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
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DATA SHEET * SKY65131
Evaluation Board Description
The Skyworks SKY65131 Evaluation Board is used to test the performance of the SKY65131 power amplifier driver. An assembly drawing for the Evaluation Board is shown in Figure 11. The layer detail is provided in Figure 12 and Figure 13 identifies the physical characteristics of each layer.
Electrostatic Discharge (ESD) Sensitivity
The SKY65131 is a static-sensitive electronic device. Do not operate or store near strong electrostatic fields. Take proper ESD precautions.
Table 1. SKY65131 Signal Descriptions
Pin # 1 2 3 4 5 6 7 8 GND RF_IN RF_IN VCC1 VC_BIAS VREF1 VREF2 PA_ON Name Ground RF input RF input Stage 1 collector voltage Bias voltage Bias referance voltage 1 Bias referance voltage 2 PA on/off control signal Description Pin # 9 10 11 12 13 14 15 16 VCC2 GND RF_OUT RF_OUT VDET_CNTL V_DET VCC_DET GND Name Description Stage 2 collector voltage Ground RF output RF output Detector voltage control Detector output signal Detector supply voltage Ground
Table 2. SKY65131 Absolute Maximum Ratings
Parameter RF input power Supply voltage PIN VCC1, VC_BIAS, VREF1, VREF2, VCC2, and VCC_DET ICC Symbol Minimum Maximum 4 4 Units dBm V
Supply current (ID + IBIAS) Power dissipation Case operating temperature Storage temperature Junction temperature
Note:
500 2
mA W C C C
TC TST TJ
-40 -55
+85 +125 +150
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value.
Table 3. SKY65131 Recommended Operating Conditions
Parameter RF input power Supply voltage PIN VCC1, VC_BIAS, VREF1, VREF2, VCC2, and VCC_DET TC TST 3.0 3.3 Symbol Minimum Typical Maximum -3 3.6 Units dBm V
Case operating temperature Storage temperature
-40 -55
+85 +125
C C
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DATA SHEET * SKY65131
Table 4. SKY65131 Electrical Specifications (VCC = 3.3 V, TC = +25 C, Test Frequency = 2.442 GHz unless otherwise noted)
Parameter Symbol Test Condition Min Typical Max Units
Using IEEE802.11b Complimentary Code Keying Input Signal, Data Rate = 11 Mbps Supply current Output power (Note 1) Power added efficiency (Note 2) Ramp-up/ramp-down (Note 3) ICC POUT PAE TS 490 27 41 <0.5 mA dBm % s
Using IEEE802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps Supply current Output power (Note 4) Power added efficiency (Note 2) Using Continuous Wave Input Signals Small signal gain Gain flatness over band Gain flatness over channel (16.25 MHz) Output power @ 1 dB compression Quiescent Current Noise Figure Power added efficiency Thermal resistance (junction-to-case) Power Up/Down Control Power up Power down PA_ON/OFF PA_ON/OFF 2.7 3.3 0.5 V V P1dB IQ NF PAE RTH,J-C PIN = 3 dBm G PIN = -15 dBm From 2.4 GHz to 2.5 GHz Over any 16.25 MHz within band PIN = 3 dBm 26 1.0 0.2 28 150 5 38 50 dB dB dB dBm mA dB % C/W ICC POUT PAE 400 26 33 mA dBm %
Note 1: Defined as the maximum power level for which the IEEE802.11b transmit mask requirements are met. Note 2: Measured at the specified average output RF power and modulation type. Note 3: Ramp-up and ramp-down times are defined from the 10% to 90% power points. Note 4: Defined as the maximum power level for which the IEEE802.11g transmit mask requirements are met.
30 28 26
27.0 26.8 26.6 26.4
Output Power (dBm)
24
20 18 16 14 12 10 -15 -13 -11 -9 -7 -5 -3 -1 +1 +3 +5
Gain (dB)
22
26.2 26.0 25.8 25.6 25.4 25.2 25.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
Input Power (dBm)
Frequency (GHz)
Figure 3. Typical POUT and Gain vs PIN @ 2.442 GHz
Figure 4. Typical Gain vs Frequency Response
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DATA SHEET * SKY65131
6.0 5.8 5.6
+10 0 IEEE 802.11g Specification Mask
Noise Figure (dB)
5.4 5.2 5.0 4.8 4.6 4.4 4.2 4.0 2.40 2.41 2.42 2.43 2.44 2.45 2.46 2.47 2.48 2.49 2.50
Relative Power (dB)
-10 -20 -30 Pout = +26.0 dBm -40 -50 2.411
2.417
2.423
2.430
2.436
2.442
2.448
2.454
2.461
2.467
2.473
Frequency (GHz)
Frequency (GHz)
Figure 5. Typical Noise Figure Performance vs Frequency
Figure 6. Output Spectrum Response for 802.11g (64 Quadrature Amplitude Modulated, 54 Mbps Input Signal)
+10 0 IEEE 802.11b Specification Mask
1.8 1.6
Detector Output Voltage (V)
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10 12 14 16 18 20 22 24 26 28 30
Relative Power (dB)
-10 -20 -30 -40 Pout = +27.5 dBm -50 -60 2.411
2.417
2.423
2.430
2.436
2.442
2.448
2.454
2.461
2.467
2.473
Frequency (GHz)
Output Power (dBm)
Figure 7. Output Spectrum Response for 802.11b CCK-Coded (11 Mbps Input Signal)
Figure 8. Detector Output Voltage vs RF Output Power
9 8 7 6
EVM (%)
5 4 3 2 1 0 17 18 19 20 21 22 23 24 25 26
Output Power (dBm)
Figure 9. EVM vs Pout for 802.11g (64 Quadrature Amplitude Modulated, 54 Mbps Input Signal)
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DATA SHEET * SKY65131
L4 10 nH
L6 10 nH
VCC_DET
C7 3300 pF C14 8.2 pF
V_DET
16
15
14
VCC_DET
V_DET
GND
C13 43 pF 13 L3 1.5 nH R3 51
1
GND RF_IN RF_IN VCC1
VDET_CNTL RF_OUT
2
12
RF In
L1 10 nH
3
SKY65131
RF_OUT GND
PA_ON
11
RF Out
VCC1
C8 10 F C2 3300 pF L2 10 nH C1 DNI
4
10
5
VREF1
VREF2
VC_BIAS
VCC2
9 C6 3300 pF C12 10 F
VCC2
VC_BIAS
C3 3300 pF
6
7
8
PA_ON VREF2
R2 150
VREF1
C4 3300 pF R1 200 C5 3300 pF
Note: Evaluation Board material: four-layer Rogers 4003-12, r = 3.38
Figure 10. SKY65131 Evaluation Board Schematic
S324
C8 C3 L2 C4 R1 R2
C2 L1 C1 L4 L6 C13 L3 C5 C12 C9 R3 C14 C7
J4
J3
S581
Figure 11. Evaluation Board Assembly Drawing
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DATA SHEET * SKY65131
Layer 1: Top Metal
Layer 2: Ground
Layer 3: Inner Traces
Layer 4: Ground
S580
Figure 12. Evaluation Board Layer Detail
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DATA SHEET * SKY65131
Cross Section
Name Thickness (mils) Material
L1 Lam1 L2_GND Lam2 L3_GND Lam3 L4 1.4 12 1.4 4 1.4 12 1.4 Cu, 1 oz. Rogers 4003-12 Cu, 1 oz FR4-4 Cu, 1 oz. FR4-12 Cu, 1 oz.
r
- 3.38 - 4.35 - 4.35 -
S573
Figure 13. Layer Detail Physical Characteristics
1.90 4.0 Pin 1 Indicator 1.00 0.85 R0.2 Metal Pad Pin 1 Indicator
1.70
A
4.0
1.00 1.90
0.85
B
Top View
0.4 0.03 Metal Pad Edge Mold 1.5 0.1
Bottom View
Solder Mask Opening
0.5 0.03 Metal Pad Edge
0.4 0.03 0.5 0.03 0.4 0.03
0.1
0.1
Side View
All dimensions are in millimeters
Detail A
Detail B
S108
Figure 14. SKY65131 16-Pin MCM Package Dimensions
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DATA SHEET * SKY65131
1.73 0.10
Pin #1 Indicator
8.00 0.10
4.00 0.10
1.50 0.10
2.00 0.05
1.75 0.10
B
5.50 0.05
A
4.35 0.10
A
7o Max 0.229 0.02
B
1.50 0.25
B
Notes: 1. Carrier tape material: black conductive polycarbonate or polysterene 2. Cover tape material: transparent conductive PSA 3. Cover tape size: 9.3 mm width 4. All measurements are in millimeters 4.30 0.10
8o Max
A
S187
Figure 15. SKY65131 16-Pin MCM Tape and Reel Dimensions
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12.00 +0.30/-0.10
DATA SHEET * SKY65131
Ordering Information
Model Name SKY65131 WLAN Power Amplifier Module Manufacturing Part Number SKY65131-21 Evaluation Kit Part Number TW13-D341
Copyright (c) 2003, 2004, 2005 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks(R), the Skyworks logo, and Breakthrough Simplicity(R). Product names or services listed in this publication are for identification purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.
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